MALCOM DS-11S máy phân tích nhiệt độ, thời gian X-Y hàn chọn lọc (0～300℃)

Malcom Japan

DIP TESTER for Selective Soldering Machine

Model: DS-11S

The Malcom DS-11S Dip Tester for Selective Soldering Machine is a specialized, self-contained measuring instrument used for comprehensive quality control and process analysis specifically in selective soldering equipment. The "S" model includes advanced features tailored to the selective soldering process, where measurements need to be precise for individual solder nozzles

• The self contained DS-11S rides along the conveyor like a PCB.
• Measures the record's maximum PCB topside preheat temperature.
• Confirms flux and solder levels.
• Measures and records the maximum temperature and dwell times of both solder waves.
• Programable temperature profiles make it possible to monitor 50ms sampling temperatures of the preheat & solder temperature sensors, in addition to the conventional management items.

• Comprehensive Parameter Measurement: The DS-11S simultaneously measures multiple critical factors as it passes through the machine like a PCB, including solder temperature, soldering time (dwell time), temperature rise conditions (preheat profile), moving speed (X-Y speed), and the physical dimensions (size) of the solder nozzle.
• Selective Soldering Specifics: Unlike a standard wave solder tester, the DS-11S is designed to accommodate and individually assess the condition of up to five different solder nozzles, which is essential for machines with multiple nozzles.
• Accurate Sensing: It features a solder temperature sensor with small heat capacity for accurate measurements within the selective soldering environment, and new dip time sensors for highly accurate contact time detection.
• Data Analysis and Management: Data is collected and can be viewed directly on the unit's display or transferred to a PC via USB connection. The dedicated software allows for advanced analysis, temperature profiling displays, and automated pass/fail (OK/NG) judgments, improving overall process management efficiency

Specifications

The information required for managing flow soldering equipment (preheat temperature, solder temperature, dip time) can be measured simply by placing it on the conveyor and running it through. ■ The standard for flow soldering bath management, the dip tester, has been redesigned. ■ Equipped with USB communication and profile measurement functions, and enables more advanced management using dedicated software. ■ Includes a cooling stand to quickly cool the device and also serves as a stand to protect the sensor. Pic: MALCOM Diptester DS-11S for selective soldering equipment at Semiki's warehouse The Malcom DS-11S Dip Tester is used to measure and analyze key parameters of the selective soldering process in electronics manufacturing. It is a self-contained device that travels along the conveyor line like a printed circuit board (PCB) to gather data on the soldering conditions.

• Temperature Analysis: Measures and records the maximum preheat temperature on the topside of the PCB and the maximum temperature of the solder waves.
• Dwell Time: Measures the contact time (dip time) of the PCB with the solder waves.
• Process Parameter Confirmation: Confirms the levels of flux and solder in the machine.
• Speed Measurement: Determines the X and Y axis moving speeds through the soldering process.
• Nozzle Assessment: Can individually assess the condition of up to five nozzles in multi-nozzle systems.
• Quality Control: The collected data and temperature profiles (sampled every 50ms) can be analyzed using dedicated software to perform pass/fail (OK/NG) judgments and manage quality control data without needing a PC during the measurement itself.