HAKKO Solder Wick FR551-25250-J dây bấc hàn loại bỏ chất hàn (2.5 mm x 25m)

HAKKO Japan 

FR511 SERIES

Desoldering Wire WICK

No-clean halogen-free

Adopting ‘Halogen-free’ flux Eco-friendly

HAKKO Solder wick FR-551 Series No-clean halogen-free. 

Made in Japan

Model: FR551-25250-J  (2.5mm width x 25m length)

The Hakko FR551-25250-J Solder Wick is used for desoldering applications, primarily to remove excess solder from printed circuit boards (PCBs), electronic components, and for repair and rework of electronic devices HAKKO Desoldering Wire WICK Solder wick Product code: FR551-25250-J (No-clean halogen-free 2.5mm width x 25m length) at Semiki’s warehouse.

 Applications

• Solder Removal: The primary function is to absorb and remove molten solder from connections, allowing for component replacement or correction of soldering mistakes.
• Rework and Repair: It is an essential tool for maintenance, repair, and rework applications in electronics assembly.
• Dismounting Components: It is particularly useful for removing solder after dismounting surface-mounted components, including Ball Grid Arrays (BGAs).
• Cleaning Solder Bridges/Shorts: It helps designers and fabricators correct errors like solder bridges and shorts on circuit boards

Specification:

Usage/Applications Desoldering wire is used to remove solder from an elemental device or from patterns on a printed circuit board (PCB) from which surface-mounted devices such as BGA (ball grid array) have been removed. Place the desoldering wire on where you want to desolder, and put a soldering iron on top to melt a solder joint.

Suitable width can be chosen from 1.5 mm to 5 mm for your work

You can cut the WICK without switching to nippers after solder removal, improving work efficiency.

WICK Cutter FT-630

1.5 m rolls and 25 m rolls are available

DISTRIBUTED BY: Semiki instrumentation Co., Ltd Email:  sales@semiki.com Office tel: +84 979761016 ~DOING OUR BEST FOR YOU~